Military Embedded Systems

Semiconductors to be manufactured in U.S. under DoD, GLOBALFOUNDRIES partnership


February 15, 2021

Emma Helfrich

Technology Editor

Military Embedded Systems

Stock image.

MALTA, N.Y. GLOBALFOUNDRIES (GF), a specialty foundry, announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF's Fab 8 in Malta, New York. These semiconductor chips will be used in sensitive DoD applications for land, air, sea, and space systems.

Under the agreement, GF will aim to provide a supply of chips built at Fab 8 on its differentiated 45nm SOI platform. According to the company, the agreement is made possible by Fab 8's compliance with U.S. International Traffic in Arms Regulations (ITAR) and highly restrictive Export Control Classification Numbers under the Export Administration Regulations (EAR).

The new supply agreement builds upon the partnership between the DoD and GF to provide chips for defense, aerospace, and other defense applications. GF currently supplies the DoD with chips manufactured at GF's other on-shore facilities, Fab 10 in East Fishkill, New York, and Fab 9 in Burlington, Vermont.

The company claims that the first chips from this new agreement are targeted to begin delivery in 2023. GF is in ongoing discussions with the DoD regarding Trusted Accreditation for Fab 8.


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