Senseeker Corp, a leading innovator of digital infrared image sensing technology, has announced the availability of the Neon® RD0131, an advanced digital readout integrated circuit (DROIC) that expands the Neon product family with the addition of a high definition 1280 x 1024 format.

SANTA BARBARA, Calif. Senseeker Engineering, a leading innovator of digital infrared image sensing technology, has announced the availability of the Neon RD0033, an advanced digital readout integrated circuit (DROIC) with low-noise performance, triple-gain modes, and a 10 μm pitch pixel with a capacitive transimpedance amplifier (CTIA) front-end circuit.

Santa Barbara, California (October 5th, 2021) — Senseeker Engineering, a leading innovator of digital infrared image sensing technology and cryogenic test solutions, has introduced a cryogenic test and evaluation kit for the Oxygen RD0092 digital readout IC (DROIC) that enables focal plane array (FPA) developers to expedite their FPA development and evaluation process.

SANTA BARBARA, Calif. Senseeker Engineering, a company that designs and makes digital infrared image-sensing technology, has completed the acquisition of SE-IR Corporation, a maker of cryogenic test equipment and electronics.

Santa Barbara, California (August 27th, 2020) — Senseeker Engineering, a leading innovator of digital infrared image sensing technology, has reduced the barriers to entry to procure state-of-the-art digital readout ICs by introducing sales of quarter wafers of the Oxygen RD0092 digital readout IC (DROIC). This allows customers to acquire a reduced minimum order quantity of ICs at lower-cost for evaluation and prototyping.

Santa Barbara, California (July 2nd, 2020) — Senseeker Engineering, a leading innovator of digital infrared image sensing technology, can now respond to customer requirements more quickly by providing a cleanroom-based wafer probe capability that supports quick-turn, in-house wafer testing.

SANTA BARBARA, Calif. Imaging-sensor IC maker Senseeker Engineering has established an in-house clean room-based wafer probe capability that supports quick-turn, in-house wafer testing.