Rochester Electronics
Articles related to Rochester Electronics
Radar/EW
Planning for and minimizing the costs of obsolescence in military and aerospace applications - Story
September 06, 2023Military and aerospace supply chains are facing greater challenges than ever before, as systems in these arenas require longer development times and have longer production life cycles than any other industry. The industry must work to overcome such obstacles as component obsolescence in aging systems, prioritization of funding for long-term procurement and maintenance, coordination on the timing of and transition to newer systems, and lengthened budget cycles.
Comms
Life cycle management, semiconductor re-creation, and mitigating counterfeit parts - Story
November 29, 2018
Obsolescence management continues to be a challenge for military system designers, who are faced with designing for platforms that must last decades but using components that become obsolete in 18 months. In the following Q and A with Daniel Deisz, Director of Design Technology at Rochester Electronics, he discusses how Department of Defense (DoD) planners need to build in life cycle management costs in projects up front, the advantages of authorized re-creation or porting of semiconductor components for extending the life of parts, the importance of testing for aftermarket solutions, and how best to mitigate the spread of counterfeit components in the defense supply chain. Edited excerpts follow.
Comms
Comms
Radar/EW
Comms
Comms
Eradicating device obsolescence - Story
September 15, 2014
Device obsolescence is the status of a part when it is no longer available. The problem of obsolescence is very prevalent in microelectronics technology as the life cycles for microelectronic parts are often in conflict with equipment life cycles. In addition, microelectronics technology has a long history of obsolescence issues. Obsolescence extends beyond electronic parts to other materials like textiles and mechanical parts. In addition, obsolescence can also appear in software, specifications, standards, processes, and packaging technologies.
