RANCHO CUCAMONGA, Calif. Three new General Micro Systems (GMS) innovations won Best of Show from Military Embedded Systems magazine at the Association for the United States Army (AUSA) Annual Meeting & Exposition in Washington, D.C.

AUSA 2022 ANNUAL MEETING & EXPOSITION -- Washington, D.C. General Micro Systems (GMS) introduced a new product family of 3U and 6U OpenVPX computer boards, peripherals, and ATR-style chassis for use in U.S. Army ground, air, communications, and weapons systems at the AUSA show this week. 

RANCHO CUCAMONGA, California. – General Micro Systems today launched its battery-powered “X9 Spider Wearable” S1502-MP mobile computer intended for dismounted soldiers and Marines who need on-the-move high-performance processing, communications, video, database access and artificial intelligence (AI). Designed from the ground up to offer the most compute power and I/O in the smallest, lightest weight battery-powered package, X9 Spider Wearable can drive up to four on-body displays; connect to wireless LANs and personal area networks (PANs); uplink to mounted assets like vehicles or command posts; store up to 20TB of onboard data, and connect to high-rate body sensors while processing on-board AI algorithms such as image/facial recognition, target tracking or sensor fusion. The S1502-MP is one of several technologies GMS will feature at the Association of the United States Army (AUSA) Annual Meeting & Exposition in Washington, D.C., October 10-12 (booth 8221, Hall DE).

AUSA 2021--WASHINGTON. Military Embedded Systems is excited to announce today the winners of our Best in Show Award contest, which which we're holding for our supporters exhibiting at the Association of the U.S. Army (AUSA) Annual Meeting, held last week, Oct. 11-13 in Washington, D.C. Contest winners -- drawn from military embedded systems exhibitors at the event -- are recognized for the improved performance and innovation they bring to military electronic systems applications such as radar, electronic warfare, and avionics as well as for rugged computing, interconnect technology, artificial intelligence (AI), and embedded computing.