Aeroflex announces flight-ready, next-generation microprocessors at NSREC
NewsJuly 14, 2014
PARIS. Engineers at Aeroflex Microelectronic Solutions - HiRel in Colorado Springs, Colo. announced the availability of two next generation UT699E and UT700 LEON 3FT-based microprocessors at the Nuclear Space Radiation Effects Conference (NSREC) this week in Paris. The UT699E is in production with prototypes available for the UT700 and production planned for the second half of this year.
The next generation LEON family products -- the LEON UT699E and UT700 -- migrated from 250nm CMOS down to 130nm CMOS process technology. The 1.2V core UT699E operates at 100MHz and is pin-to-pin compatible with the UT699. Software developed for the UT699 is also compatible with the UT699E and UT700.
Both devices leverage a seven-stage pipelined, fault-tolerant SPARC V8/LEON 3FT CPU and a compliant 2.0 AMBA bus interface that integrates the LEON 3FT CPU with Ethernet, SpaceWire, memory controller, CANbus, 32-bit 33MHz PCI,, and programmable interrupt peripherals.
The 166 MHz UT700 is a version of the UT699E that has a more powerful Reed Solomon EDAC scheme, SPI port, as well as a 1553 interface for supporting the bus controller/remote terminal monitor functions. Reed Solomon EDAC provides fault-tolerant protection for external SDRAM. To support the additional peripherals, the UT700 has a slightly different pinout, but is provided in the same Ceramic Land Grid Array (CLGA) packages as the UT699/699E.
Aeroflex officials plan to update the UT699 Power Calculator for the UT699E/700 by late next year. The SMD number 5962-13237 has been assigned to the UT699E, while the UT700 SMD number is 5962-13238. Pricing is $20,500.00 with QML screening in lots of 100 for the UT699E; the UT700 is $21,600.
For more information, call 1-800-645-8862 or visit www.aeroflex.com/LEON.
