Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

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RF system-in-package tech to support C4ISR capabilities

March 31, 2022

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SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
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Radar SiP contract announced by Mercury

June 26, 2020

Avionics
Image via Kongsberg
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Bell 412 helicopters to be upgraded for Norwegian Armed Forces by Kongsberg

September 04, 2024

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Unmanned
MQ-9 Reaper image: U.S. Air Force courtesy photo
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UAS market for military use to rise 13.8% to 2023, study predicts

September 05, 2024

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Radar/EW
Image via Kirintec
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BAE Systems acquires electronic warfare company Kirintec

September 05, 2024

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Comms
Image via Northrop Grumman
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Integrated ground system for Space Development Agency to be developed by General Dynamics

September 05, 2024

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