Military Embedded Systems

Topic: system-in-package

Story
An evolution in the industry: Top trends for Space 2.0

June 22, 2022

Space 2.0 represents a major shift in the development of defense and aerospace applications: With artificial intelligence (AI) applications moving aboard, systems must support higher processing and throughput capabilities. On-orbit processing requires an adaptive architecture so that systems can process, analyze, and reconfigure themselves to optimize performance and responsiveness. This, in turn, is driving innovation in organic packaging and reliability. Finally, to build these complex systems, engineers need greater design agility to accelerate development, maintain lower costs, and achieve faster time-to-launch.

News
RF system-in-package tech to support C4ISR capabilities

March 31, 2022

News
SiP devices unveiled based on AMD-Xilinx Zynq UltraScale+ MPSoC architecture

March 24, 2022

Radar/EW
News
Radar SiP contract announced by Mercury

June 26, 2020

Unmanned
MQ-9 Reaper image: U.S. Air Force courtesy photo
News
UAS market for military use to rise 13.8% to 2023, study predicts

September 05, 2024

More Unmanned
Radar/EW
Image via Kirintec
News
BAE Systems acquires electronic warfare company Kirintec

September 05, 2024

More Radar/EW
A.I.
Story
Ultra’s Chief Growth Officer Chris Bishop to keynote CJADC2 Virtual Summit Sept. 12

August 28, 2024

More A.I.
Comms
Image via Northrop Grumman
News
Integrated ground system for Space Development Agency to be developed by General Dynamics

September 05, 2024

More Comms