Thermal testing of electronic components
ProductMay 31, 2014
Designed for power cycling and thermal testing of electronics components to simulate and measure lifetime performance, the MicReD Industrial Power Tester 1500A from Mentor Graphics Corporation combines power cycling and thermal transient measurements with structure function analysis while...
Designed for power cycling and thermal testing of electronics components to simulate and measure lifetime performance, the MicReD Industrial Power Tester 1500A from Mentor Graphics Corporation combines power cycling and thermal transient measurements with structure function analysis while providing data for real-time failure-cause diagnostics. Power components are used for applications where electrical energy is generated, converted, or controlled and also where high reliability is necessary during long operational lifetimes. The Mentor Graphics solution enables electronic manufacturers to test reliability by examining the thermally induced degradations within the module stack-up. Measurements are conducted on the MicReD Power Tester 1500A, without having to remove the components from the test environment. A technician or engineer is able to see the failure as it progresses and determine the exact time/cycle and cause. The MicReD Power Tester 1500A can power modules through tens of thousands – potentially millions – of cycles while delivering real-time failure-in-progress data for diagnostics, which reduces test and lab diagnosis time and eliminates the need for post-mortem or destructive failure analysis. The Power Tester 1500A analyses thermally-induced mechanical failures such as die-attach wire bond separations, die, package stack-up delamination and cracks, and solder fatigue. The product can perform power cycling tests of Insulated-Gate Bipolar Transistors (IGBTs), Metal-Oxide Semiconductor Field-Effect Transistors (MOSFETs), and power diodes
