VadaTech Announces a Rugged, High speed DSP unit utilizing Xilinx VU13P with Integrated Layer 3 Managed SwitchPress Release
July 29, 2021
Henderson, NV – July 27, 2021 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VT971.
The VT971 is a rugged conduction cooled unit which follows VITA 47 for environmental up to CC4/C3/V3/OS2. The unit accepts 32 high-speed SERDES to the Xilinx XCVU13P FPGA, which is supported by two 64-bit wide banks for DDR4 memory for the total of 16GB of memory. The FPGA is integrated with a Layer 3 Managed Gbe/10GbE Ethernet Switch, providing 26 Egress port via front of the unit. The module supports 24 GbE through RJ-45 (10/100/1000Base-T) and dual 10GbE via SFP+.
The VT971 has a quad core ARM processor utilizing four Cortex-A53 cores running at 1.4GHz. The CPU manages the layer three switch and interfaces to the FPGA via PCIe. The VT971 is ideal for applications where signals are digitized at a remote location and processed at a different site. The unit is available in conduction cooled form only and operates with input power of 10-36V DC.
VadaTech provides innovative embedded computing solutions from board-level products, chassis-level platforms, to configurable application-ready systems. With a focus on AdvancedTCA, MicroTCA, VPX and PCIe solutions, the company offers unmatched product selection and expertise. A unique combination of electrical, mechanical, software, and system-level expertise, enables VadaTech to provide customized commercial or rugged computing solutions to meet the most complex customer requirements. VadaTech also offers specialized product solutions for VME, CompactPCI, and other architectures. A member of PICMG and VITA, VadaTech has headquarters, design and manufacturing facilities in Henderson, NV with design, support and sales offices in Europe and Asia Pacific.