RF semiconductor packaging contract awarded to Qorvo by U.S. DoD programNews
November 05, 2020
GREENSBORO, N.C. Radio-frequency (RF) semiconductor maker Qorvo has won a contract from the U.S. government -- worth as much as $75 million -- to create a state-of-the-art heterogeneous integrated packaging (SHIP) RF production and prototyping center.
According to a company statement, the SHIP program is intended to ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients who need design, validation, assembly, test, and manufacturing of next-generation RF components. As part of the contract, Qorvo is tasked with designing and delivering the highest levels of heterogeneous packaging integration, a strategy that is critical for the U.S. government and defense contractors to meet the size, weight, power, and cost (SWaP-C) requirements for next-generation phased-array radar systems, unmanned vehicles, electronic warfare platforms, and satellite communications.
The exclusive SHIP Other Transaction Agreement (OTA) was awarded to Qorvo by the Naval Surface Warfare Center (NSWC), Crane Division and funded by the Office of the Undersecretary of Defense for Research and Engineering’s (OUSD R&E) Trusted and Assured Microelectronics Program (T&AM); the program is administered by the Strategic & Spectrum Missions Advanced Resilient Trusted System (S²MARTS) Other Transaction Agreement (OTA), managed by National Security Technology Accelerator (NSTXL).