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Sealevel Systems, Inc.

Articles related to Sealevel Systems, Inc.
Comms

Flat-panel rugged touchscreen computer intended for harsh, hazardous environments - Product

November 16, 2014
The SeaPAC R9-8.4 from Sealevel Systems combines a RISC-based embedded computer with a bright LED-backlit thin-film-transistor LCD touchscreen to create a ruggedized, flat-panel computer intended for use in a variety of human-machine interface applications.
Avionics

MIL-STD-1553 IP cores challenge traditional IC implementation - Story

March 11, 2014
Forty years since its release, MIL-STD-1553 is evolving from traditional Integrated Circuits (ICs) to Intellectual Property (IP) cores integrated with Field Programmable Gate Arrays (FPGAs). The advantages of IP core implementation include cost reduction, the ability to upgrade and adapt a design over time, a smaller size footprint, and improved sourcing. Designers choosing IP cores must consider validation testing, code size, FPGA support, and compatibility with legacy software.
Avionics

Partnership to deliver 1553 technology on FPGA-based ComExpress modules - News

January 30, 2013
SAN DIEGO. Officials at Sealevel Systems, Inc. and Sital Technology LTD, joined hands to manufacture and deliver MIL-STD-1553 IP cores, board-level products, and components as well as custom computer designs for avionics and military applications. The companies made the announcement at the AFCEA West show in San Diego this week.
Comms

Sealevel COM Express Custom Carrier Board Solutions - Video

May 01, 2012
COM Express, a widely supported implementation of Computer on Module (COM) design, minimizes the difficulty of custom computer board design by combining the processing, memory, video, Ethernet and USB functionality in a small, highly integrated module....
Unmanned

COM Express enables application-specific data acquisition systems - Story

October 12, 2011
Military system designers often struggle with finding COTS technologies that can meet critical application requirements. Custom designs almost always offer the best opportunity to create an optimized design, but time to market and design costs can be prohibitive. A hybrid architecture using a Computer on Module (COM) for the core processing functionality with a custom carrier board for application-specific I/O can offer the best of both worlds. This approach eliminates the time and risk associated with a custom processor design while the less-complex carrier board provides the advantages of a purpose-built design.