Congatec
San Diego, CA 92121 sales-us@congatec.com
+1 858-457-2600
https://www.congatec.com/us.html
Radar/EW
congatec introduces three new Server-on-Module families with Intel Xeon D processors - Press Release
February 25, 2022San Diego, CA, 24 February, 2022 * * * congatec – a leading vendor of embedded and edge computing technology – celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.
Radar/EW
congatec launches COM-HPC Carrier Design Guide compliant ecosystem - Press Release
February 10, 2022San Diego, CA, 10 February, 2022 * * * congatec – a leading vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.
Radar/EW
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors - Press Release
August 04, 2021San Diego, CA, 3 August, 2021 * * * congatec – a leading vendor of embedded and edge computing technology – introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.
Radar/EW
New ultra-rugged 11th Gen Intel Core congatec modules with soldered RAM - Press Release
July 16, 2021San Diego, CA, 14 July 2021 * * * congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.
Radar/EW
New congatec modules with 11th Gen Intel Core processors for outdoor and in-vehicle applications - Press Release
November 13, 2020San Diego, CA, 10 November 2020 * * * congatec – a leading vendor of embedded and edge computing technology – introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments.
Radar/EW
congatec introduces new ecosystem for COM-HPC - Press Release
November 13, 2020San Diego, 10 November 2020 * * * congatec – a leading vendor of embedded and edge computing technology – introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake). The new COM-HPC standard impresses with a broad range of latest high-speed interfaces such as PCIe Gen 4 and USB4, a future proof high-speed connector, and a comprehensive feature set for remote management. The latter, in particular, is of utmost importance for all the emerging broadband connected edge applications, which range from dedicated edge devices to rugged edge clouds and real-time fogs.
Radar/EW
congatec premiers AMD Ryzen Embedded V2000 processor on COM Express Compact - Press Release
November 13, 2020San Diego, CA, 10 November 2020 * * * congatec – a leading vendor of embedded and edge computing technology – significantly broadens the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the new Ryzen Embedded V2000 processor impresses with up to 2x generational uplift in performance per watt , a 2x more CPU cores compared to previous generations, at only 76% of the previous size on a 100% pin-compatible form factor.
