Military Embedded Systems

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GE Intelligent Platforms, Inc.

5 Necco Street
Boston, MA 02210
GE Intelligent Platforms, Inc.
Articles related to GE Intelligent Platforms, Inc.

Prequalified system-level COTS takes the load - Story

January 23, 2015
With military budgets under fire and program schedules increasingly pinched, design managers are focusing more than ever on cost. Gone are the days of gold-plated programs entailing high risk of cost overruns and schedule breaches. Suppliers are on the hot seat to deliver systems within tight cost and time constraints.

Using VITA 75 and standards-based modular design to address SWaP-C challenges - Story

December 04, 2014
As the world's armed forces look to deploy computing capability and unmanned vehicles ever closer to the battlefield edge, size, weight, and power (SWaP) are at a premium. The use of modular building blocks such as COM Express (PICMG COM.0) and/or XMC (VITA 42) - and, for packaging, the rugged small form factor (VITA 75) - represent an excellent means to address the requirements of minimizing size, weight, power, and cost (SWaP-C).

Digital image processing - Story

November 28, 2014
High-definition (HD) digital electro-optic and infrared sensors are shoveling evermore data into the battle space. How can soldiers get that information quickly enough to act on it in a timely manner?

SWaP sweeps and edge processors adapt - Story

October 01, 2014
Size, weight, and power (SWaP) considerations have always been important for embedded electronics, but as platforms shrink, SWaP constraints are becoming ever more critical. Larger platforms will, of course, continue to use “big” processors that are optimized for performance. However, the proliferation of intelligence at the tactical edge is driving military demand for rugged off-the-shelf chips, modules, and boards that provide just enough performance for their applications. These parts must bu

FPGA or GPU? - The evolution continues - Story

September 16, 2014
A GE Intelligent Platforms perspective on embedded military electronics trends

The cutting edge of thermal management - Story

September 12, 2014
The biggest challenge for system integrators today is thermal management. With access to the latest-generation processors, GPUs, and switch fabrics, system integrators must find creative ways to remove the heat created by this vast computing power. These thermal challenges call for innovative thermal solutions to maximize the performance for computing-intensive applications.