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September 2023

 
 
 
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The McHale Report, by militaryembedded.com Editorial Director John McHale, covers technology and procurement trends in the defense and aerospace electronics community.
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LCR Embedded Systems
 
 
 
 
 
 
DSEI COVERAGE
 
Many questions on open architecture initiatives and the Department of Defense (DoD) modular open systems approach (MOSA) mandate were being floated to U.S. embedded hardware and software suppliers at DSEI in London this week. So, over dinner last night, I asked Chip Downing, Outreach Committee Co-chair of the Future Airborne Capability Environment (FACE) Consortium and Senior Market Development Director for Aerospace and Defense at RTI, what type of open architecture strategies are being pursued by European defense departments and if the U.S initiatives like FACE influenced those efforts.
 
 
DSEI COVERAGE
 
BAE Systems selected Collins Aerospace to provide the Large Area Display technology for cockpits of future Eurofighter Typhoon aircraft. BAE Systems engineers will use the ultra-high-definition Large Area Display (LAD) as part of its rapid capability development program, Project Medulla, which sees it investing in future technologies for use across its combat air portfolio, including Eurofighter Typhoon.
 
 
 
 
DSEI COVERAGE
 
BAE Systems won a contract from the United Kingdom Ministry of Defence (MOD) to develop its Striker II Helmet Mounted Display (HMD) for the Royal Air Force (RAF) Typhoon fleet.
 
 

DSEI COVERAGE

 
I spent my first day touring the USA pavilion at DSEI 2023 in London. It’s my first time back to this massive show in four years; I saw many familiar faces and technologies from U.S. defense electronic suppliers, from connectors and signal-processing solutions to avionics boxes and rugged servers.
 
 
 
 
 
 

Electronic warfare, radar and SIGINT applications demand direct RF solutions to deliver low-latency, real-time signal processing solutions for critical real-time decision-making. The DRF3182 3U OpenVPX direct RF FPGA board offers fast wideband data capture up to Ku band at the edge with heterogeneous FPGA processing.

 
 
 
 
 
SPONSORED CONTENT
 
This week’s product, the Omnetics Nano-D Bi-Lobe and MIL-STD 32139 connectors, meet stringent size, weight, and power (SWaP) requirements for ruggedized miniature electronic solutions. The devices are suited for applications with extreme signal-integrity and harsh-environment specifications, such as radar, weapons systems, communications gear, satellites, instrumentation, avionics, and more.
 
 
SPONSORED CONTENT
 
This week’s product, the Annapolis Micro Systems WILDSTAR SAF1 Direct RF Small Form Factor Module with the Intel Agilex Direct RF Series FPGA, may be deployed as a single standalone unit for edge applications close to the sensor and in other tight envelope man-packable environments, or dual-mounted on a 3U OpenVPX baseboard for processing-intensive applications such as electronic warfare (EW) and signals intelligence (SIGINT).
 
 
 
 
 
 
AirBorn
 
 
 
 
 
 
INDUSTRY PERSPECTIVE
 
Advances in generative artificial intelligence (AI) are enabling adversaries to build new attacks faster and evade signature-based threat detection with ease. The cutting edge of adversarial cybersecurity is becoming more sophisticated, using new technologies to rapidly develop new attacks. Defensive cybersecurity efforts must keep pace with bad actors by using new tools that combine attack signal intelligence with pattern-matching capabilities to identify polymorphic threats, or cyberthreats that employ evasive techniques to evade detection from traditional security solutions.
 
 
INDUSTRY SPOTLIGHT
 
ARTICLE IMAGE
Military and aerospace supply chains are facing greater challenges than ever before, as systems in these arenas require longer development times and have longer production life cycles than any other industry. The industry must work to overcome such obstacles as component obsolescence in aging systems, prioritization of funding for long-term procurement and maintenance, coordination on the timing of and transition to newer systems, and lengthened budget cycles.
 
 
 
 
 
 
Annapolis Micro Systems
 
 
 
 
 
 
DSEI COVERAGE
 
Leaders of defense organizations in Italy, Japan, and the United Kingdom signed a trilateral Collaboration Agreement to deliver the concept phase requirements of a next generation combat aircraft for the Global Combat Air Program (GCAP).
 
 
DSEI COVERAGE
 
ARTICLE IMAGE
Military Embedded Systems is pleased to announce the winners of its Best In Show awards at this week's DSEI 2023 global defense exhibition.
 
 
 
 
SPONSORED WHITE PAPER
 
Analog Devices
Millimeter wave scanners are superior to traditional metal detectors because they can identify and locate both metallic and nonmetallic threats. This article describes how mmWave imaging hardware works and will present a chipset that uses edge processing to manage massive data loads to enable the development of walkthrough security scanning systems.
 
 
SPONSORED WHITE PAPER
 
Critical I/O
This new whitepaper explore the use of a high speed Ethernet RDMA interconnect between a GPU system and NVMe based storage system. Combined with Critical I/O’s StoreEngine and StorePak NVMe 3U VPX modules and built-in recording software, this approach moves data directly to and from GPU memory with high efficiency and ultra-low latency.
 
 
 
 
 
 
Sponsored by: Wind River
Date: October 18, 11:00 a.m. ET
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