In the world of defense-grade FPGA [field-programmable gate array] devices, solder column attachment is the weakest link in the assembly process. Today, 90% of America’s FPGA device makers rely on a single subcontractor to attach solder columns, creating a potential supply chain vulnerability. The problem can be solved by engaging multiple subcontractors already established throughout North America. Device makers just need to qualify these alternative subcontractors in order to assure sustainability and resiliency of the defense-grade FPGA supply.

Using cutting-edge microcircuits in space and defense systems with natural space-radiation requirements, while risky, also comes with potential rewards. There is a path for insertion of these cutting-edge solutions into space and defense systems: The use of a parts, materials, and process (PMP) program.

Artificial intelligence (AI) qualifies as a once-in-a-generation technology because it transforms so many aspects of warfighting, from speeding analysis of data from the Internet of battlefield things (IoBT) for more informed decision-making, to transforming weapons systems, soldier training, health monitoring, robotics, and unmanned systems. However, identifying battlefield AI use cases is far easier than developing the embedded hardware and software required to enable AI at the tactical edge. Gaining a better understanding of these challenges – and how to address them – can deliver asymmetric advantages to U.S. military commanders on the modern battlefield.

With recent advances in artificial intelligence (AI) to factor in, the advent of what is now commonly referred to as the kill web relies on solving the challenges that come with the design of an architecture that allows human users and AI to safely coexist in that system of systems. Such an architecture needs to be evolutive and support iterative improvements, plus it must be technologically and structurally adaptive, scalable, modular, and, of course, secure -- all while placing human decision at its core.

Radiation-hardened analog/mixed-signal ASICs [application-specific integrated circuits] present significant challenges in terms of cost, development time, and qualification. One of the most promising new approaches applies structure to the analog/mixed-signal design process and fabrication methodology in the same way FPGAs [field-programmable gate arrays] and structured arrays have done for digital ASICs.

Satellites, spacecraft, and communications systems are leveraging the performance benefits of gallium nitride (GaN) RF components as demonstrated by the successful landing of the Mars Perseverance Rover. GaN also fuels innovation in military electronic warfare and radar systems. Dean White, senior director of Defense and Aerospace for Qorvo, discussed these trends with me in the following Q&A. We also covered the COVID-19 pandemic’s impact on the U.S. semiconductor industry, military funding, and the engineering recruitment in the defense industry. Edited excerpts follow.

Cosmic rays are able to cause the failure of electronics in service and may be difficult to separate from other causes of reliability issues. While the electronics failure rate has been reduced to a level acceptable in a commercial context (for example, how often does your computer hang nowadays, compared with 20 years ago?), the military requirements surrounding failure are more stringent. Additional measures are necessary both to achieve the level of confidence demanded for such applications and to prevent the malfunction or total failure of satellites, rockets, missiles, aircraft, unmanned systems, and other equipment.