In the following Q and A with Daniel Deisz, Director of Design Technology at Rochester Electronics, he discusses how Department of Defense (DoD) planners need to build in life cycle management costs in projects up front, the advantages of authorized re-creation or porting of semiconductor components for extending the life of parts, the importance of testing for aftermarket solutions, and how best to mitigate the spread of counterfeit components in the defense supply chain.

The Future Airborne Capability Environment (FACE) Consortium, part of The Open Group, was formed to establish a standard common operating environment to ­support portable capability-based applications across Department of Defense (DoD) avionics systems. 

Advances in artificial intelligence (AI) are enabling significant leaps in science and technology, including the fields of digital signal processing (DSP) and radio frequency (RF) systems. Methods nominally labeled as "AI" have been applied to radio systems for decades, but always with the goal of optimizing the control plane of a hand-engineered system (e.g., "smart radios" or "cognitive radios").

ADLINK has developed its Vortex DDS implementation as a reference to align to the FACE Technical Standard Edition 2.1.1 TSS, using DDS as the underlying transport layer. This is fully compatible and interoperable with the commercially supported Vortex OpenSpliceTM V6.10 solution.

Active electronically steered phased array (AESA) systems provide the technology platform for multifunction radio-frequency (RF) systems. Today’s systems can include a combination of radar, electronic warfare (EW), and communications functionality within the same physical system using a common antenna array front end.

Airborne systems that need a small footprint or must comply with an industry assurance standard such as DO-178B [1] or DO-178C [2] are sensitive to size and complexity costs in the run-time support libraries.

The world of high speed connectivity is constantly changing and evolving, which is why we made it easier for you to make smart decisions about which high-speed interconnect products you should use. Everything you need to design your application is at your fingertips in TE Connectivity’s (TE) High-Speed Products Developer Kit.

The electromagnetic spectrum is an increasingly contentious warfare domain. This evolution presents new challenges for scientists and engineers who are designing intelligence, surveillance, and reconnaissance (ISR) systems. Engineers are asked to develop increasingly complex systems using more cost- and time-effective methods.

Get your hardware/software solution recognized at the top Defense Electronics shows in the U.S. and Europe.

Military Embedded Systems will be highlighting the best products and solutions at the defense electronics industry's top trade shows across the US and Europe.

• Build publicity around your products at the event
• Get recognized by our audience of Defense Prime Contractors, and System Integrators, and to Embedded COTS Suppliers

Winners will be announced at the respective events.