Xpedition Package Integrator aimed at codesign teams
ProductJune 14, 2015
The Xpedition Package Integrator from Mentor Graphics is aimed at enabling integrated circuit, packaging, and printed circuit board (PCB) codesign teams to visualize and optimize single or multichip packages integrating silicon on board platforms. The software, according to the maker, can...
The Xpedition Package Integrator from Mentor Graphics is aimed at enabling integrated circuit, packaging, and printed circuit board (PCB) codesign teams to visualize and optimize single or multichip packages integrating silicon on board platforms. The software, according to the maker, can reduce the cost of the entire system while enabling greater control of the design process. Its codesign methodology targets many PCB platforms automating the planning, optimization, and connectivity from a chip through multiple packaging variables. Package Integrator users can drive rule-based I/O-level optimization and perform pin- and ball-out studies from their respective domains, visualizing the impact across the complete system, and generating an automated central data library in the process. Additional features include integration platform, collaboration, model analysis and verification, physical design, and manufacturing preparation.
The physical design includes interactive and customizable multipass auto-routing controls for design challenges such as differential pair routing, net tuning, manufacturing optimization and HDI/microvia and buildup technology. This capability allows Xpedition Package Integrator to be a single layout flow for PCB, MCM, SiP, RF, hybrid, and BGA designs. The single flow – using familiar user environments – reduces design times, says Mentor, compared to other tools that use proprietary scripting languages.
